Accelerated lifetime estimation of thermosonic Cu ball bonds on Al metallization
- Author(s)
- Alice Lassnig, Wolfgang Trasischker, Golta Khatibi, Brigitte Weiss, M. Nelhiebel, Rainer Pelzer
- Organisation(s)
- Physics of Nanostructured Materials
- External organisation(s)
- Infineon Technologies AG, Infineon Technologies Austria AG
- Journal
- Microelectronic Engineering
- Volume
- 106
- Pages
- 188-194
- No. of pages
- 7
- ISSN
- 0167-9317
- DOI
- https://doi.org/10.1016/j.mee.2013.02.015
- Publication date
- 2013
- Peer reviewed
- Yes
- Austrian Fields of Science 2012
- 202028 Microelectronics, 103018 Materials physics, 201108 Fracture mechanics
- Portal url
- https://ucrisportal.univie.ac.at/en/publications/accelerated-lifetime-estimation-of-thermosonic-cu-ball-bonds-on-al-metallization(d25519b8-9e54-425a-822c-7d461a5be9ac).html