Evaluation of thermal degradation of polymer based electronic materials by non-destructive testing

Author(s)
P. Rafiee, G. Khatibi, M. Lederer, M. Zehetbauer
Abstract

Thermal degradation of polymeric materials used in microelectronic packages was studied by means of experimental modal analysis in combination with finite element methods. The devices were subjected to vibrational loads subsequent to various stages of high temperature storage and their modal response was recorded. Statistical methods and finite element analysis were applied to quantify and evaluate the alteration of the modal response of the packages due to the degradation / delamination of the silver filled epoxy adhesive and the glass filled epoxy resin molding compound. It was shown that changes in the material properties of the molding compound due to surface oxidation is the dominant cause for alteration of the modal response of encapsulated packages exposed to high temperatures.

Organisation(s)
Physics of Nanostructured Materials
External organisation(s)
Technische Universität Wien
Journal
Journal of Physics: Conference Series
Volume
790
No. of pages
5
ISSN
1742-6588
DOI
https://doi.org/10.1088/1742-6596/790/1/012026
Publication date
02-2017
Peer reviewed
Yes
Austrian Fields of Science 2012
103018 Materials physics
ASJC Scopus subject areas
Physics and Astronomy(all)
Portal url
https://ucris.univie.ac.at/portal/en/publications/evaluation-of-thermal-degradation-of-polymer-based-electronic-materials-by-nondestructive-testing(5c374e47-2afe-464b-b02b-11ec460b04b7).html