Univ.-Prof. i.R. Dipl.-Ing. Dr. Brigitte Weiss
T: +43-1-4277-72808
Summer term 2019
Winter term 2018

Lederer, M, Magnien, J, Khatibi, G & Weiss, B 2015, FEM simulation of the size- and constraining effect in lead-free solder joints with the theory of strain gradient elasticity. in 1st International Conference on Rheology and Modeling of Materials (IC-RMM1)., 012020, Journal of Physics Conference Series, vol. 602, IOP Publishing Ltd, BRISTOL, 1st International Conference on Rheology and Modeling of Materials ((IC-RMM), Hungary, 7/10/13. https://doi.org/10.1088/1742-6596/602/1/012020

Khatibi, G, Lederer, M, Czerny, B, Betzwar-Kotas, A & Weiss, B 2014, A New Approach for Evaluation of Fatigue Life of Al Wire Bonds in Power Electronics. in J Grandfield (ed.), Light Metals 2014. John Wiley & Sons, Inc., pp. 271-277, TMS 2014 143rd ANNUAL MEETING & EXHIBITION , San Diego, United States, 16/02/14. https://doi.org/10.1002/9781118888438.ch47

Khatibi, G, Lederer, M, Czerny, B, Betzwar-Kotas, A & Weiss, B 2014, A Novel Experimental and Numerical Approach for Lifetime Assessment of Microelectronic Devices. in B Michel (ed.), Smart System Integration for Micro- and Nanotechnologies: Honorary volume on the occasion of Thomas Gessner's 60th birthday . Goldenbogen, pp. 445-452.

Danninger, H, Sohar, C, Xu, C, Weiss, B, Betzwar-Kotas, A & Khatibi, G 2014, Fatigue Behaviour of Different Types of PM Steels in the Gigacycle Range. in Konferenzband PM Conference 2014, Orlando.


Khatibi, G, Weiss, B & Betzwar-Kotas, A 2013, A Mechanical testing procedure for electronic components, Patent No. N. 10 2013 109 504.6.


Khatibi, G, Lederer, M, Lassnig, A & Weiss, B 2013, Application of accelerated mechanical test techniques for evaluation of microelectronic components. in Micromaterials and Nanomaterials. vol. 15, pp. 158-162, Leipzig, Germany, 25/02/13.


Lederer, M, Zarbakhsh, J, Huang, R, Detzel, T & Weiss, B 2013, 'Stresses in Cu films during thermal fatigue', Freiberg, Germany, 27/03/13, .

Lassnig, A, Pelzer, R, Khatibi, G, Weiss, B, Nelhiebel, M & Zehetbauer, M 2012, 'Accelerated Lifetime Measurements of Cu-Al Ball Bonded Interconnects' EURO SimE 2012, Cascais, Portugal, 16/04/12 - 18/04/12, .

Lassnig, A, Pelzer, R, Khatibi, G, Weiss, B & Nelhiebel, M 2012, Accelerated Lifetime Measurements of Cu-Al Ball Bonded Interconnects. in 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) IEEE Components. Institute of Electrical and Electronics Engineers ( IEEE ), Piscataway, NJ , pp. 1-5, EURO SimE 2012, Cascais, Portugal, 16/04/12. https://doi.org/10.1109/ESimE.2012.6191732

Khatibi, G, Weiss, B & Gröger, V 2012, 'An ultrafast mechanical test system for bending fatigue studies of multilayered electronic components' Electronics System Integration Technology Conferences (ESTC) IEEE-CPMT, Amsterdam, Netherlands, 17/09/12 - 20/09/12, .

Ress, W, Khatibi, G, Weiss, B & Groeger, V 2012, An ultrafast mechanical test system for bending fatigue studies of multilayered electronic components. in 2012 4th Electronic System-Integration Technology Conference (ESTC). IEEE Computer Society, NEW YORK, 4th Electronic System-Integration Technology Conference (ESTC), Amsterdam, Netherlands, 17/09/12. https://doi.org/10.1109/ESTC.2012.6542197



Dlapka, M, Danninger, H, Gierl, C, Klammer, E, Weiss, B, Khatibi, G & Betzwar-Kotas, A 2012, 'Fatigue behavior and wear resistance of sinter-hardening steels', International Journal of Powder Metallurgy, vol. 48, no. 5, pp. 49-60.



Khatibi, G, Ipser, H, Lederer, M & Weiss, B 2012, Influence of Miniaturization on Mechanical Reliability of Lead-free Solder Interconnects. in KN Subramanian (ed.), Lead-free solders: Materials reliability for electronics. John Wiley & Sons, Ltd., pp. 443-485. https://doi.org/10.1002/9781119966203.ch18

Khatibi, G, Puchner, S, Weiss, B, Zechmann, A, Detzel, T & Hutter, H 2012, Influence of titanium surface contamination on the reliability of Al wire bonds. in Proceedings of the 18th European Microelectronics and Packaging Conference. IEEE, pp. 1-7.


Horky, J, Lederer, M, Weiss, B, Zehetbauer, M & Zagar, BG 2011, Application of a locally operating laser-speckle strain sensor on tensile deformation of miniaturized nanostructured specimens. in Proceedings of the 20th IMEKO TC2 Symposium on Photonics in Measurement: May 16-18, 2011 Linz Austria. Shaker, pp. 101-103.


Dlapka, M, Danninger, H, Gierl, C, Weiss, B, Khatibi, G & Betzwar-Kotas, A 2011, Gigacycle Fatigue Of Different Low Alloyed PM Steels For Sinter Hardening. in Proceedings of Euro PM2011. Unknown publisher.


Horky, J, Khatibi, G, Weiss, B & Zehetbauer, M 2011, 'Influence of purity and grain size on the fatigue crack growth behaviour of SPD nano copper' 2nd Int. Workshop Plasticity of Nanocrystalline Metals, Bosen, Germany, 25/09/11 - 28/09/11, .

Trasischker, W, Lassnig, A, Khatibi, G, Weiss, B, Nelhiebel, M & Pelzer, R 2011, Lifetime of thermosonic copper ball bonds on Al metallization pads. in Proc. of Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM), 2011 : 8-12 May 2011 . IEEE, pp. 1-3. https://doi.org/10.1109/IITC.2011.5940359




Khatibi, G, Lederer, M, Weiss, B, Licht, T, Bernardi, J & Danninger, H 2010, Accelerated mechanical fatigue testing and lifetime of interconnects in microelectronics. in Fatigue 2010. Procedia Engineering, no. 1, vol. 2, Elsevier BV, North-Holland, pp. 511-519. https://doi.org/10.1016/j.proeng.2010.03.055









Sohar, C, Betzwar-Kotas, A, Gierl, C, Weiss, B & Danninger, H 2009, 'Fatigue behaviour of M2 and M42 high speed steel up to the gigacycle regime', Kovove Materialy - Metallic Materials, vol. 47, no. 3, pp. 147-158.

Sohar, CR, Betzwar-Kotas, A, Gierl, C, Weiss, B & Danninger, H 2009, 'PM tool steels push the edge in fatigue tests', Metal Powder Report, vol. 64, no. 2, pp. 12-17. https://doi.org/10.1016/S0026-0657(09)70013-X


Sohar, C, Betzwar-Kotas, A, Gierl, C, Weiss, B & Danninger, H 2008, 'Anisotropy effects on gigacycle fatigue behaviour of high Cr alloyed cold work tool steel', Kovove Materialy - Metallic Materials, vol. 46, no. 4, pp. 197-207.




Zimprich, P, Saeed, U, Weiss, B & Ipser, H 2008, Mechanical Properties of Lead-free Solder Joints - The Size Effect. in Processing Materials for Properties (Proceedings TMS 2008). Unknown publisher, pp. 625-630.




Zagar, BG, Zimprich, P & Weiss, B 2006, Exploring the world of micromaterials using laser-speckle techniques. in Speckle06: Speckles, From Grains to Flowers., 63412Z, Progress in Biomedical Optics and Imaging - SPIE, vol. 6341, International Society for Optical Engineering (SPIE). https://doi.org/10.1117/12.695998




Khatibi, G, Stickler, R & Weiss, B 2003, 'Strength and ductility of thin Cu wires', International Journal of Materials Research, vol. 94, no. 6, pp. 749-753.

Weiss, B, Gröger, V, Khatibi, G, Betzwar-Kotas, A, Zimprich, P, Stickler, R & Zagar, BG 2002, 'Characterization of mechanical and thermal properties of thin Cu foils and wires', Sensors and Actuators A: Physical, vol. 99, no. 1-2, pp. 172-182. https://doi.org/10.1016/S0924-4247(01)00877-9


Hadrboletz, A, Weiss, B & Stickler, R 2000, Significance of the intrinsic threshold - what is new? in Fatigue Crack Growth Thresholds, Endurance Limits, and Design. ASTM Special Technical Publications, vol. 1372, pp. 31-45. https://doi.org/10.1520/STP13424S


Fatigue of hardmetals in the gigacycle regime

Brigitte Weiss (Contributor)
22 Mar 201623 Mar 2016

Activity: Talks and presentationsTalk or oral contributionOther


Accelerated Mechanical Fatigue Testing and Lifetime of Interconnects in Microelectronics

Brigitte Weiss (Contributor)
25 Sep 2012

Activity: Talks and presentationsTalk or oral contributionOther


Influence of high temperature exposure on lifetime of Cu-Al interconnects

Brigitte Weiss (Contributor)
3 Apr 2012

Activity: Talks and presentationsTalk or oral contributionOther


On the sensitivities of fatigue and crack propagation to the purity of UFG Cu

Brigitte Weiss (Contributor)
3 Apr 2012

Activity: Talks and presentationsTalk or oral contributionOther


Fatigue and crack propagation in SPD Cu with regard to microstructural stability

Brigitte Weiss (Contributor)
28 Mar 2012

Activity: Talks and presentationsTalk or oral contributionOther


Stress-strain behavior of lead free solder joints determined by digital image correlation techniques and finite element modeling

Brigitte Weiss (Contributor)
14 Mar 2012

Activity: Talks and presentationsTalk or oral contributionOther


Microstructural investigation of interfacial features in Al wire bonds

Brigitte Weiss (Contributor)
13 Mar 2012

Activity: Talks and presentationsTalk or oral contributionOther


FEM Simulation of the Size and Constraining Effect in Lead Free Solder Joints

Brigitte Weiss (Contributor)
7 Nov 2011

Activity: Talks and presentationsTalk or oral contributionOther


Fatigue Crack Growth Behaviour of Nanostructured Cu: Role of Grain Size, Purity and Strength

Brigitte Weiss (Contributor)
21 Sep 2011

Activity: Talks and presentationsTalk or oral contributionOther


Influence of Ti-surface contamination on reliability of Al wire bonds

Brigitte Weiss (Contributor)
14 Sep 2011

Activity: Talks and presentationsTalk or oral contributionOther


Application of a Locally Operating Laser-Speckle Strain Sensor on Tensile Deformation of Miniaturized Nanostructured Specimens

Brigitte Weiss (Contributor)
17 May 2011

Activity: Talks and presentationsTalk or oral contributionOther


Lifetime of thermosonic copper ball bonds on Al metallization pads

Brigitte Weiss (Contributor)
10 May 2011

Activity: Talks and presentationsTalk or oral contributionOther


Influence of microstructural stability on the fatigue and crack propagation behaviour of copper deformed by high pressure torsion

Brigitte Weiss (Contributor)
22 Mar 2011

Activity: Talks and presentationsTalk or oral contributionOther


A fast test technique for life time estimation of ultrasonically Cu-Cu interconnects

Brigitte Weiss (Contributor)
2 Mar 2011

Activity: Talks and presentationsTalk or oral contributionOther


Ein neues beschleunigtes Testverfahren zum Prüfen der mechanischen Zuverlässigkeit von Lotverbindungen

Brigitte Weiss (Contributor)
1 Mar 2011

Activity: Talks and presentationsTalk or oral contributionOther


Influence of microstructural stability on the fatigue and crack growth behaviour of HPT Cu

Brigitte Weiss (Contributor)
1 Mar 2011

Activity: Talks and presentationsTalk or oral contributionOther


Reliability and vibrational fatigue response of ball grid array packages

Brigitte Weiss (Contributor)
1 Mar 2011

Activity: Talks and presentationsTalk or oral contributionOther


Thermomechanische Ermüdung und Lebensdauer von Mikroverbindungen in der Elektronik

Brigitte Weiss (Speaker)
5 Oct 2010

Activity: Talks and presentationsTalk or oral contributionOther


Role of Structural Parameters of Ultrafine Grained Cu for its Fatigue and Crack Growth Behaviour

Brigitte Weiss (Contributor)
6 Jul 2010

Activity: Talks and presentationsTalk or oral contributionOther


Fatigue crack Growth Behaviour of Ultrafine grained Copper Processed by high Pressure Tension

Brigitte Weiss (Contributor)
9 Jun 2010

Activity: Talks and presentationsTalk or oral contributionOther


Physics of Nanostructured Materials

Boltzmanngasse 5
1090 Wien

T: +43-1-4277-72808
F: +43-1-4277-872808

brigitte.weiss@univie.ac.at