Accelerated lifetime estimation of thermosonic Cu ball bonds on Al metallization

Author(s)
Alice Lassnig, Wolfgang Trasischker, Golta Khatibi, Brigitte Weiss, M. Nelhiebel, Rainer Pelzer
Organisation(s)
Physics of Nanostructured Materials
External organisation(s)
Infineon Technologies AG, Infineon Technologies Austria AG, Universität Wien
Journal
Microelectronic Engineering
Volume
106
Pages
188-194
No. of pages
7
ISSN
0167-9317
DOI
https://doi.org/10.1016/j.mee.2013.02.015
Publication date
2013
Peer reviewed
Yes
Austrian Fields of Science 2012
202028 Microelectronics, 103018 Materials physics, 201108 Fracture mechanics
Portal url
https://ucris.univie.ac.at/portal/en/publications/accelerated-lifetime-estimation-of-thermosonic-cu-ball-bonds-on-al-metallization(d25519b8-9e54-425a-822c-7d461a5be9ac).html