Experimental and analytical study of geometry effects on the fatigue life of Al bond wire interconnects

Author(s)
Bernhard Czerny, I. Paul, G. Khatibi, M. Thoben
Organisation(s)
Physics of Nanostructured Materials
External organisation(s)
Infineon Technologies AG
Journal
Microelectronics Reliability
Volume
53
Pages
1558-1562
No. of pages
5
ISSN
0026-2714
DOI
https://doi.org/10.1016/j.microrel.2013.07.090
Publication date
09-2013
Peer reviewed
Yes
Austrian Fields of Science 2012
202025 Power electronics, 103018 Materials physics, 201108 Fracture mechanics
Portal url
https://ucris.univie.ac.at/portal/en/publications/experimental-and-analytical-study-of-geometry-effects-on-the-fatigue-life-of-al-bond-wire-interconnects(60896672-4502-41c8-96cf-227a3e3a67ab).html